What we can do?
Our Systems Engineering Solutions offer complete system hardware and software solutions, from FPGA-based prototyping systems to comprehensive Hardware-Firmware and System on Chip (SoC) based platforms.
Design & Develop sophisticated Embedded System Solutions
DSP/FPGA/uP based Product Architecture, Design and Prototyping
RTL (Verilog/VHDL) Coding & FPGA prototyping and Testing
Product Engineering, Product qualification and Certification(UL, CSA)
AE Provide Integrated design services including Design for Manufacturing, as well as Design for Assembly focusing mechanical housings, we contribute to strengthen your design and making it ready for manufacturing. Partnering with us at the early stage of your project will help isolate design imperfections impacting the manufacturability of your product.
Our design and engineering teams at Anvita Electronics bring value to the product development process by being involved virtually at every stage of the design cycle – From design, engineering to prototyping and printed circuit board assembly to volume production and end-of-life support. AE provide engineering services with process that involves searching and analysing reliable and sustainable solutions to optimise circuit board manufacturing and assembly of your product.
One of the essential early steps in the inventing process is creating a prototype which enables you to test and refine the functionality of your design. AE is organized with a specific team led by a prototype coordinator which regroups and handles the customer’s needs and matches them according to industrial constraints. This “prototype” team works with materials suppliers, parts vendors, fabricators, and manufacturers to develop functional prototypes of your product.
AE have capability in realizing the system with the trained manpower under the supervision of expertise and demonstrate at client premises.
Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis and heat transfer. High-reliability equipment often must survive drop tests, vibration, extreme temperatures, humidity, rain, salt spray, explosive shock, and many more. We at RTS balance many objectives and practical considerations when selecting packaging methods through analysis to estimate such things.